Lumilens
IC Package FEA Engineer
About this role
Lumilens seeks an experienced IC Package Mechanical FEA Engineer to design and optimize advanced semiconductor packaging solutions for high-performance photonic systems serving AI and HPC markets. You'll leverage deep FEA expertise to simulate complex multi-chip architectures, manage thermo-mechanical reliability, and collaborate across R&D, manufacturing, and reliability teams to influence designs from concept through production.
What you'll do
- Perform FEA simulations to evaluate stress, warpage, delamination, and thermal reliability across flip-chip, 3DIC, and chiplet-based package architectures
- Define simulation requirements, analyze results, and deliver design and process recommendations
- Lead DOE studies and sensitivity analyses to identify key reliability and performance drivers
- Support technology roadmapping by assessing new materials and process flows from a thermo-mechanical perspective
- Collaborate with design, photonics, manufacturing, and reliability teams to ensure scalable package designs
- Calibrate models with empirical data and conduct lab experiments to validate simulations
What they're looking for
- FEA tools (Ansys Classic/Mechanical, Abaqus)
- Advanced semiconductor packaging technologies (flip-chip, FOWLP, 2.5D/3D, TSVs, chiplets)
- Materials science and thermo-mechanical behavior (polymers, metals, ceramics)
- Semiconductor packaging processes (die attach, underfill, molding, bumping, reflow)
- Mechanical testing and metrology
- DOE and sensitivity analysis
- Cross-functional collaboration and technical communication
- First-principles mechanical engineering analysis and problem-solving
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Lumilens
Lumilens builds photonic chiplets and high-speed optical components for AI supercomputing and next-generation data center infrastructure. The company is hiring digital RTL designers, verification engineers, optical test engineers, and systems applications engineers to develop and validate its optical and electrical integration technologies.
View all jobs at LumilensLikely interview questions
- Walk us through your experience with FEA modeling of advanced packaging technologies like flip-chip, 3DIC, or fan-out wafer-level packages. What were the key simulation challenges and how did you validate your models?
- Describe a time when your FEA predictions didn't match experimental results. How did you investigate the discrepancy and what did you learn about your modeling approach?