Lightmatter
System Mechanical Design Engineer
About this role
Lightmatter is looking for a dedicated Mechanical Design Engineer to help create innovative chassis and rack platforms for next-generation AI servers. The ideal candidate will leverage advanced mechanical design skills to transform complex concepts into manufacturable hardware while collaborating with a talented team.
What you'll do
- Design and document hardware of moderate to high complexity.
- Optimize the packaging of optical and electrical components for thermal performance.
- Generate CAD designs, BOMs, and work instructions.
- Facilitate design reviews and implement feedback.
- Lead in-house builds and manage external manufacturing.
- Collaborate with cross-functional teams for technical investigations.
What they're looking for
- Bachelor's degree in Mechanical Engineering or related field
- 5+ years in system mechanical design
- Expertise in 3D CAD software (e.g., SolidWorks)
- Experience with thermal and structural testing
- Familiarity with mechanical engineering design tools (ANSYS preferred)
- Strong understanding of heat transfer principles
- Experience in electronics packaging
- Strong communication skills
Benefits
- Competitive compensation package
- Equity grants for new hires
- Annual performance-based equity
- Opportunities for professional growth
- Dynamic startup environment
- [unknown]
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Lightmatter
Lightmatter builds silicon photonics-based optical interconnect products and AI data center infrastructure powered by advanced photonic technologies. The company is hiring hardware validation engineers, mechanical designers, and mixed-signal validation engineers to design test systems, verify high-speed electro-optic links, develop server chassis platforms, and optimize photonic communication circuits.
- Website
- lightmatter.com
Likely interview questions
- Walk us through a complex mechanical design project you led from CAD to manufacturing. How did you handle the transition from prototype to production with contract manufacturers?
- Describe your experience with thermal management in electronics packaging. What analysis tools have you used, and how do you approach designing for extreme heat dissipation?