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Lightmatter

Mechanical Design Engineer

Mountain View, CAFrom $212kmidAdded 1 month ago

About this role

Lightmatter is seeking a Mechanical Design Engineer to focus on advanced packaging technologies for AI architectures that enhance performance and efficiency. The role involves collaboration with various teams to optimize product designs while ensuring mechanical integrity and manufacturability.

What you'll do

  • Develop CAD models for package stack-up and components
  • Conduct mechanical design analysis for package integrity
  • Perform tolerance stack-up analyses and create GD&T drawings
  • Influence design decisions with manufacturing expertise and FMEAs
  • Collaborate with system teams to align packaging solutions with specifications

What they're looking for

  • BS or MS in Mechanical Engineering or related field
  • 3+ years in mechanical design, particularly in semiconductor packaging
  • Proficiency in CAD tools like Solidworks or Creo
  • Expertise in GD&T and tolerance stack-up analysis
  • Knowledge of semiconductor packaging technologies
  • Understanding of FEA tools for structural analysis

Benefits

  • Comprehensive Health Care Plan
  • Retirement Savings Matching Program
  • Generous Time Off
  • Paid Family Leave
  • Flexible, hybrid workplace model
  • Equity grants for full-time employees
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Lightmatter

Lightmatter builds silicon photonics-based optical interconnect products and AI data center infrastructure powered by advanced photonic technologies. The company is hiring hardware validation engineers, mechanical designers, and mixed-signal validation engineers to design test systems, verify high-speed electro-optic links, develop server chassis platforms, and optimize photonic communication circuits.

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Likely interview questions

  • Walk us through your experience with GD&T and tolerance stack-up analysis. Can you describe a specific project where micron-level precision was critical to product performance?
  • Tell us about your experience with semiconductor packaging technologies—specifically 3D, 2.5D, and FCBGA architectures. What mechanical and thermal trade-offs have you had to navigate?