Tenstorrent
Chiplet Physical Design Engineer
About this role
Tenstorrent is seeking a Senior Chiplet Physical Design Engineer to lead the design and integration of chiplets into System-in-Package solutions. This remote position focuses on high-performance CPU and AI silicon in collaboration with diverse international teams.
What you'll do
- Design and integrate multiple chiplets in SiP solutions
- Collaborate with teams across the USA and globally
- Manage synthesis and place-and-route for CPU core designs
- Contribute to performance, power, and area outcomes
- Mentor junior engineers and influence methodologies
- Ensure project execution amidst technical and resource constraints
What they're looking for
- 10+ years in physical design for CPUs or GPUs
- Expertise in Synopsys and/or Cadence tools
- Strong timing closure and ECO flow experience
- Proficient in scripting (TCL required, Python preferred)
- Excellent communication skills
- Experience with advanced nodes (3nm and below)
- Detail-oriented and ownership-driven
- Team player with mentoring capabilities
Benefits
- Competitive salary ranging from $100k - $500k
- Remote work opportunity
- Diverse team environment
- Learning opportunities in chiplet architecture
- Collaborative culture across global teams
- Equitable employment practices
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Tenstorrent
Tenstorrent develops advanced AI technologies and high-performance CPU chip designs, building the hardware and compiler infrastructure to support next-generation AI computing. The company is hiring hardware engineers (DFT, physical design, timing analysis, emulation) and software engineers (compiler development) to optimize chip manufacturing, performance, and AI software solutions.
- Website
- tenstorrent.com