SK hynix America
Advanced Package Design Engineer
About this role
SK hynix America is seeking an Advanced Package Design Engineer to join their team in San Jose, CA. The role involves designing and optimizing interposer architectures for advanced packaging solutions, requiring collaboration across multiple engineering disciplines.
What you'll do
- Design silicon and organic interposers for packaging solutions
- Utilize EDA tools to create and verify advanced package layouts
- Conduct design studies and optimize package designs
- Maintain layout design rules and guidelines
- Collaborate with stakeholders in technology development
What they're looking for
- Bachelor’s or Master’s in Electrical Engineering or related field
- 3+ years in semiconductor package design
- Proficiency in Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
- Knowledge of high-speed signal routing and power distribution networks
- Familiarity with 2.5D/3D packaging technologies
- Effective communication and teamwork skills
Benefits
- Top tier health insurance at no employee cost
- Paid time off and company holidays
- Paid parental leave program
- 401k matching
- Educational reimbursement up to $10,000 per year
- Corporate discount programs
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SK hynix America
SK hynix America designs advanced memory solutions including high-bandwidth memory (HBM) and AI-focused memory architectures, with a focus on next-generation chip performance and energy efficiency. The company is hiring circuit design engineers, systems engineers, application engineers, and packaging specialists to develop innovative memory technologies for AI and high-performance computing platforms.
- Website
- skhynix.com